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ehva-product_opal-single-die_exfo_1800x1200.jpg

OPAL-SD - Single-die automated probe station

$0.00

Entry-level, flexible, cost-effective and upgradeable. Automated optical alignment and test of photonic integrated circuits (PIC) with traceable results that can be queried. Manual positioning of die and electrical probes.

Entry-level, flexible, cost-effective and upgradeable. Automated optical alignment and test of photonic integrated circuits (PIC) with traceable results that can be queried. Manual positioning of die and electrical probes.

Key features

  • Characterization of a single singulated die

  • Research-grade solution for PIC testing and characterization

  • Flexible design with repositionable optical and electrical RF/DC heads

  • Preparation, automated execution (alignment, instrument control) and data management (repository, analysis) with EXFO Pilot software

  • Different optical head options, as needed: Up to 6 motorized axes for surface and edge coupling with single fibers or fiber arrays

  • Precise DC and RF probing positioners

Applications

  • Optical and electrical probing and testing of PIC at the die, module or bar-level

  • For R&D, low-volume design verification and test development

  • Perfect for academia and R&D teams

  • Opto-electronic testing of integrated photonic platforms (e.g., silicon photonics, indium phosphide, III-V, polymer, heterogeneous)

  • Application-agnostic (e.g., telecom & datacom transceivers, quantum, LIDAR, sensors, AI)

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Spec sheet