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Highlights
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OPAL-EC delivers scalable wafer-level testing for edge-coupled PIC, enabling high-density, automated testing for foundries and advanced R&D. The EXFO Pilot software suite enhances OPAL-EC hardware capabilities by automating the testing station and providing quality measurements that can be digested into actionable data.
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The station’s hardware consists of an ultra-repeatable 4-axis motion system wafer positioning stage, allowing 105° rotation with a chuck to hold up to 12-in (300-mm) wafers with thermal control as an option.
Adapter plates enable tests for single dies, bars and multiple dies enabling one station to fit all form factors. The station can accommodate up to four probing heads with a choice of optical or electrical probes.
It also includes high-resolution, in-line brightfield top vision system and telecentric side vision systems.
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EXFO Pilot is a software platform that orchestrates the complete flow of PIC test and measurement: (i) test preparation, (ii) execution of fully automated navigation, alignment and measurements at a high throughput and (iii) analysis and data management of the results.
It transforms the OPAL-EC station into an automated testing station and a source of quality measurements that can be processed into actionable data. The complete suite of applications supports the full test-and-measurements flow and helps users to become more data-driven.
Key features
From R&D, design verification and process development to early production and manufacturing
Opto-electronic testing on integrated photonics platforms: silicon photonics, indium phosphide, III-V, polymer, heterogeneous
In-depth analysis of statistical circuit performance and yield
DUT-agnostic: can test singulated dies (single to tens), reticles, custom cuts, bars, 12-inch wafers
Application-agnostic: telecom and datacom transceivers, quantum, LIDAR, sensors, AI for surface- and edge-coupling with single fiber or fiber-array to prototyping and PILOT production
Applications
Complete PIC testing platform for precise and repeatable optical alignment and electrical probing.
Preparation, automated execution (navigation, alignment, instrument control) and data management (repository, analysis) with the included EXFO Pilot software suite.
Different probe head options, as needed: Optical head models with up to 6 motorized axes for surface- and edge-coupling with single fibers or fiber arrays; Electrical heads with manual or motorized axes.
Best-in-class repeatability of optical probe heads and base motion systems.
Industry first multiport edge-coupling testing at wafer level.
Wafer, stretch-tape, multiple dies or bar testing with the same station.